Underfill material is a filler, which is used in semiconductor packaging to offer strength, increase the impact resistance, and improve the overall reliability and thermo-mechanical performance. It is used to fill space beneath a die and adhere to its carrier. The proliferation of smart technologies and the subsequently rising demand for handheld devices such as smartphones and tablets are the key factors fuelling the demand for  ... Read more

The presence of several established players has rendered the global underfill dispenser market highly fragmented. While new players are keen on venturing into the market, the high investment required in the research and development are restricting their entry. In order to gain pace, a majority of the companies are eyeing opportunities prevalent in untapped markets ... Read more