Valued at USD 22 million in 2018 the global through glass vias substrate market is estimated to reach USD 193.3 million by 2025 at a CAGR of 36.7% during the forecast period of 2019 to 2025. The glass substrate makes the hole through thin glass without damaging the glass shape.
A through-glass via (TGV) provides a vertical electrical connection through a glass ... Read more
