Minnesota, USA (06.06.2019) – In surface mount technology, solder paste deposition is a critical procedure in board assembly operations. This procedure is susceptible to defects and faults during the assembling process. These defects are found either in the solder paste itself, or in the solder printing procedure. The process of fixing these defects is extremely time consuming and results in wastage of material, additional expenditure, and intemperate ... Read more
