3D integrated circuits (ICs) are rapidly emerging as a promising technology to overcome the physical scaling limitations of conventional 2D planar chip designs. Traditional chip manufacturing has worked by reducing the size of transistors and other components on silicon wafers to pack more of them into each chip. However, this approach is reaching physical limits as transistor dimensions approach the scale of just a few nanometers. 3D ICs offer the potential to integrate more components into ... Read more
