The Asia-Pacific 3D IC’s market, by technology type statistical report, published by Market Research Future contains succinct information on the 3D IC’s market, segmented by technology type (3D stacked IC’s, Monolithic 3D IC’s) and forecast from 2016-2022. The factors driving the 3D IC’s market are Increasing demand for advanced electronic product driving semiconductor industry to innovate packaging technology, and high demand for 3D packaging using TSVs.