ESD Packaging Market Scope

The global ESD Packaging market is expected to exhibit a strong 8.2% CAGR over the forecast period from 2017 to 2023, according to the latest research report from Market Research Future (MRFR). The report studies the global electrostatic discharge packaging market in detail to find out more about the market’s leading drivers and restraints, key segments, and dominant players.

The global ESD Packaging market is mainly driven by the growing global demand for the manufacturing and transportation of electronic components. The growing manufacturing of computers, smartphones, and other networking infrastructure is likely to be a major driver for the global electrostatic discharge packaging market over the forecast period, as the demand for electrical and electronic components is likely to grow over the forecast period and beyond with the rising reliance on digital communication media. Electrostatic discharge packaging protects the product from the effects of electrostatic discharge, which can hamper a product even before it is sold and considerably reduce its operational lifetime.

Key Players

• GWP Group Limited
• Desco Industries Inc.
• Elcom UK Ltd.
• Teknis Limited
• Protektive Pak
• StaticSummit Packaging Solutions
• Stephen Gould Corp.
• Tandem Equipment Sales Inc.

Market Segmental Outline

The ESD Packaging Market’s segmental study is based on product and end-user.

By product, the market of electrostatic discharge packaging is segmented into trays, bags, boxes, ESD foams, containers, and others. By end-user, the global ESD Packaging Market is divided into consumer electronics, computer peripherals, communication network infrastructure, automotive, and others

Detailed Regional Outlook

The worldwide ESD Packaging Market is observed to grow at a rapid pace. The market in Asia Pacific is expected to hold command on the global ESD Packaging Market across the years of assessment. The fast-expanding electronics manufacturing industry is expected to contribute majorly to the growth of the ESD Packaging Market.

The presence of electronics manufacturing titans in the Asia Pacific is likely to contribute to the competitive landscape of the market. The population base of the Asia Pacific region is large. And, as the standard of living of the people of the region rise, the consumption of better electronics is rising. This is likely to surge the adoption of electrostatic discharge packaging. This is expected to surge its Asia Pacific market. In addition, the robust economy of the region and an increase in the purchasing power of people are also expected to escalate the regional market growth. The rise in production of communication equipment in economies of the APAC is another key driver for the market.

Target Audience

Manufactures

Raw Materials Suppliers

Aftermarket suppliers

Research Institute / Education Institute

Potential Investors

Key executive (CEO and COO) and strategy growth manager

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