Thermal interface materials market is likely to witness an impressive CAGR of 13.2% during the forecast period. The escalated claim from electronics sector, rising size-reduction of electronic contrivances, and incessant innovative product unveilings and developmental goings-on accepted by various companies are the prime drivers underpinning the growth of the global thermal interface materials market.

Some of the major players in the thermal interface materials market are The 3M Company, Henkel AG & Co. KGAA, Parker Hannifin Corporation, DOW Corning Corporation, Laird Technologies, Inc., Momentive Performance Materials Inc., The Bergquist Company, Inc., Indium Corporation, Wakefield-Vette, Inc., and Zalman Tech Co., Ltd.