Liquid Thermal Interface Materials Market: Worldwide Industry Analysis and New Market Opportunities Explored
Regional Players Hold Sway
The liquid thermal interface materials market is highly fragmented, with a significant presence of unorganized players. In addition to unorganized players, the regional players also account for a significant market share.
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Players in the liquid thermal interface materials market are focusing on investments in collaborative research & development and new product launches to consolidate their position in the market. Some of the recent notable developments in the liquid thermal interface materials market include:
- To capitalize on the growing demand for lithium-ion battery thermal management, Lord Corporation launched new liquid gap fillers to be used in combination with gap pads specifically for electric vehicle batteries which offer improved thermal pathways for heat dissipation in lithium-ion batteries.
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- With innovative liquid thermal interface materials finding extensive consumer base, Henkel, a leading player in the liquid thermal interface materials market launched a cure-in-place liquid gap filler which offers an array of benefits in high-volume and high-value assemblies. Additionally, the cure-in-place liquid thermal interface forms a peelable layer that could be taken off without the need of force protecting the sensitive components of electric circuits.
- In line with the growing innovation in the thermal interface product manufacturing, WACKER and Fuji Polymer Industries announced collaboration for production of innovative silicon-based thermal interface materials for electronic devices and batteries of electronic vehicles.
- To overcome the problem of lack of optimal contact in thermal interface materials, researchers have developed a liquid thermal interface material which uses copper and nano particles for efficient thermal conduction.
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- Another research discovered that the combination of thin aluminum foil coated with a non-silicone compound could replace thermal grease as an efficient thermal interface.
Other players profiled in the report include 3M, Indium Corporation, DowDuPont, Laird Technology, Boyd Corporation, Shin-Etsu Chemical Ltd., Parker Hannifin Corp, and Marian Inc.