The hot melt adhesive tapes market size is projected to grow from USD 15.5 billion in 2019 to USD 21.7 billion by 2024, at a CAGR of 7.0%, during the forecast period. The market is witnessing a high growth due to the growing use of hot melt adhesive tapes in diverse applications. The increasing adoption of hot melt adhesive technology is also leading to the growth of the market.

Ask for free sample report @ https://www.marketsandmarkets.com/requestsampleNew.asp?id=138739970

Recent Developments
In December 2016, LINTEC Corporation acquired MACtac Americas Holdings, LLC, manufacturer and distributor of adhesive papers and films for printing in the US to get a full-scale entry into the North American market.
In July 2016, the company made a USD 20 million expansion by adding 24,000 square feet to its current Sparta facility. This facility is expected to add to the production of strapping tapes and acrylic adhesives, which will be used for healthcare applications of the hot melt-based adhesive tapes.
Rising demand from emerging economies is expected to drive the hot melt adhesive tapes market during the forecast period.

APAC is expected to be the largest and fastest-growing hot melt adhesive tapes market. The demand for hot melt adhesive tapes has increased in other APAC countries, such as South Korea, Singapore, India, and Indonesia, as the application activities in these countries have risen. China has been the driving force for the rapid expansion of the adhesive tapes market, not only in APAC, but also worldwide. In several countries, the factors affecting the packaging, which is a major application of hot melt adhesive tapes, are the increasing level of disposable income and population growth. These factors are positively influencing the hot melt adhesive tapes market growth.

Key players profiled in the hot melt adhesive tapes market report include The 3M Company (US), Nitto Denko Corporation (Japan), tesa SE (Germany), Avery Dennison Corporation (US), Intertape Polymer Group Inc. (Canada), Shurtape Technologies, LLC (US), Scapa Group plc (UK), LINTEC Corporation (Japan), ACHEM Technology Corporation (Taiwan), and TE Connectivity Ltd (Switzerland).