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Radiation Hardened Electronics Market Analysis and Forecast (2018-2023)

The global rad-hard by design market size was $XX million, and it is expected to reach $XX million by the end of 2023, growing at a CAGR of XX% during 2018-2023. This increase is primarily due to low power consumption, area of density, momentary response, and increasing government contracts for manufacturing products using rad-hard by design technique. These are the factors which give an edge to rad-hard by design technique in comparison with the other techniques.

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Rad-hard by design involves the manufacturing of an electronic device to resist radiation effects. It can be expensive and time-consuming, but sometimes it's the only solution for electronic devices for orbital and deep-space missions. Radiation hardening by design can be done by two ways:

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By Layout Modification
By Circuit Design Modification

The manufacturers are entering into a new contract for the development of advanced radiation hardened microprocessors. For instance, the U.S. government awarded a contract of $XX million to the Boeing Company to manufacture advanced radiation hardened microprocessors. The U.S. National Aeronautics and Space Administration (NASA) and the U.S. Air Force Research Laboratory are working with the Boeing Company.

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