The global semiconductor assembly and testing services market is expected to reach USD 36.65 Billion by the end of 2023
The semiconductor assembly & testing services (SATS) architecture is designed on the basis of Service. Depending on the Service the approach of Semiconductor Assembly & Testing Services (SATS) platform is designed so that the entire code can be executed as a single function. Based on Service the global Semiconductor Assembly & Testing Services (SATS) market is segmented into Assembly and Packaging.
Semiconductor assembly & testing services (SATS) can be referred to a cloud service that requires less management and easier application development platform. It enables end users to conduct programming and all other tasks without having to manage any server. With the rising adoption of cloud services, the adoption of semiconductor assembly & testing services (SATS) is increasing. Based on the applications, the Semiconductor Assembly & Testing Services (SATS) market is sub segmented into web & mobile based applications, research and academic applications and others applications.
The semiconductor testing is gaining momentum in the coming years as it electronics equipment requires smarter solutions with low cost, scalability, design, and others. These semiconductor tesing ensures long-term performance of the system. The tests wafers is driving the semiconductor market to the large extent. The semiconductor testing can improve in test times, maintaining measurement, provide high performance.
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The increasing adoption of the newest generation technologies are widely required the semiconductor assembly & testing services in consumer electronics as it increases the productivity and provides high performance. The consumer electronics devices such a smart phones, PC, laptops, television and others are integrated with semiconductors. These devices requires semiconductor assembly & testing services to reach to the customer expectations. Thus the consumer electronics applications shows significant contribution to the semiconductor assembly and testing services market.
The global semiconductor assembly and testing services market had been valued at USD 28.07 Billion in the year 2016, which is expected to reach USD 36.65 Billion by the end of the forecast period growing at ~4.54% CAGR.
Table of Contents
1 Executive Summary
2 Market Dynamics
2.1 Market Drivers
2.1.1 Growing demand of semiconductor assembly and testing services due to increasing electronic equipment production
2.1.2 The growing demand of DRAM memory
2.1.3 Increasing demand for outsourced SATS services
2.2 Market Challenges
2.2.1 Growing e-Waste Problem
2.2.2 Weakening of PC market
2.3 Market Opportuinites
2.3.1 Advanced packaging technologies
2.4 Semiconductor Assembly & Testing Services (SATS) Supply chain
2.5 Porter’s Five Forces Analysis
3 Global Semiconductor Assembly & Testing Services (SATS) Market, By Service
3.1 Introduction
3.2 Sub-segment
3.2.1 Assembly
3.2.2 Packaging
3.2.3 Testing
4 Global Semiconductor Assembly & Testing Services (SATS) Market, By Application
4.1 Introduction
4.2 Sub-segment
4.2.1 Consumer Electronics
4.2.2 Information Technology
4.2.3 Telecommunication
4.2.4 Automotive
4.2.5 Industrial
4.2.6 Others
5 Global Semiconductor Assembly & Testing Services (SATS) Market, By Region
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5.1 Introduction
5.2 Market, By Regions
5.2.1 North America
5.2.1.1 U.S.
5.2.1.2 Canada
5.2.1.3 Mexico
5.2.2 Europe
5.2.2.1 U.K. 47
5.2.2.2 Germany
5.2.2.3 France
5.2.2.4 Rest of Europe
5.2.3 Asia-Pacific
5.2.3.1 China
5.2.3.2 Taiwan
5.2.3.3 Japan
5.2.3.4 India
5.2.3.5 Rest of Asia-Pacific
5.2.4 Rest of the World (RoW)
6 Competitive Landscape
6.1 Introduction
6.2 Market Share Analysis
6.3 Company Profiles
6.3.1 Advanced Semiconductor Engineering, Inc. (U.S.)
6.3.1.1 Business Overview
6.3.1.2 Product/Service Porfolio
6.3.1.3 Business Strategy
6.3.1.4 SWOT Analysis
6.3.2 Amkor Technology, Inc. (U.S.)
6.3.2.1 Business Overview
6.3.2.2 Product/Service Porfolio
6.3.2.3 Business Strategy
6.3.2.4 SWOT Analysis
6.3.3 Siliconware Precision Industries Co., Ltd. (Taiwan)
6.3.3.1 Business Overview
6.3.3.2 Product/Service Porfolio
6.3.3.3 Business Strategy
6.3.3.4 SWOT Analysis
6.3.4 STATS ChipPAC Ltd (Singapore)
6.3.4.1 Business Overview
6.3.4.2 Product/Service Porfolio
6.3.4.3 Business Strategy
6.3.4.4 SWOT Analysis
6.3.5 Powertech Technology Inc. (Taiwan)
6.3.5.1 Business Overview
6.3.5.2 Product/Service Porfolio
6.3.5.3 Business Strategy
6.3.5.4 SWOT Analysis
6.3.6 CORWIL Technology (U.S.)
6.3.6.1 Business Overview
6.3.6.2 Product/Service Porfolio
6.3.7 Chipbond Technology Corporation (U.S.)
6.3.7.1 Business Overview
6.3.7.2 Product/Service Porfolio
6.3.8 Integrated Micro-Electronics, Inc. (U.S.)
6.3.8.1 Business Overview
6.3.8.2 Product/Service Porfolio
6.3.9 GlobalFoundries (U.S.)
6.3.9.1 Business Overview
6.3.9.2 Product/Service Porfolio
7 Appendix
7.1 Scope of the Study
7.1.1 Research Objective
7.1.2 Assumption
7.1.3 Limitation
7.2 Market Structure
8 Research Methodologies
8.1 Research Process
8.2 Primary Research
8.3 Secondary Research
8.4 Market Size Estimation
8.5 Forecast Model
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