With the technological advancements, global semiconductor industry is witnessing transition from 2D packaging to 3D packaging to cater to the requirements across end-use industries. 3D IC technology finds widespread applications in micro-electro-mechanical systems (MEMS), wireless devices, sensors, smart imagers, displays, and other electronic devices.

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The gradual shift towards 3D ICs occurred with increased demand for solutions with higher bandwidths and density of components. Increasing demand for memory enhanced application is one of the major factors contributing to the market growth of 3D ICs. 

Reduction in response time, power consumption, form factor and improved performance serve as key drivers for acceptance of 3D IC with TSV interconnect solutions.Growing demand for solutions with improved performance, quick turn-around time and increasing number of portable devices such as smartphone and tablet are driving the adoption of 3D ICs. 

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Penetration of 3D IC technology in various applications is dependent on the need of interconnect density and cost related with particular process. Several industry products such as MEMS and sensors, RF SiP, memories, optoelectronics and imaging, logic (3D SiP/SoC) and HB LED are expected to adopt 3D IC integration.