The report “Semiconductor & IC Packaging Materials Market by Types (Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, and so on), Packaging Technologies (SOP, GA, QFN, DFN, and others) & Geography – Regional Trends & Forecast to 2019″ by MarketsandMarkets is now available at RnRMarketResearch.com.

The market for semiconductor and IC packaging materials in terms of revenue is expected to reach $26 million by 2019, growing at a CAGR of 4.5% from 2014 to 2019. Asia-Pacific dominated the semiconductor and IC packaging materials market revenues in 2013. Asia-Pacific is expected to remain the major by 2019, growing at a CAGR of 5.0% from 2014 to 2019. ROW is expected to be the fastest growing markets, growing at a CAGR of 3.5% from 2014 to 2019. Europe and North America are estimated to grow at a slower CAGR of 3.0% and 3.2% respectively from 2014 to 2019, owing to the rising consumption in the Asia-Pacific region, where end-user markets of semiconductor and IC packaging materials are growing steadily.

To know more about this report (Source): http://beforeitsnews.com/business/2014/04/2019-semiconductor-ic-packaging-materials-industry-research-2613332.html

Also Get a sample copy of this report: http://www.rnrmarketresearch.com/contacts/request-sample?rname=163964

Table Of Contents

•    Introduction
•    Executive Summary
•    Semiconductor & Ic Packaging Materials Premium Insights
•    Semiconductor & Ic Packaging Materials Market Overview
•    Semiconductor & Ic Packaging Materials Market, By Type
•    Semiconductor & Ic Packaging Materials Market, By Packaging Technology
•    Semiconductor & Ic Packaging Materials Market, By Type
•    Semiconductor & Ic Packaging Materials Market, Competetive Landscape
•    Company Profiles