APEJ will Remain Fastest Expanding Market for CMP Slurry

Market-Research

Transparency Market Research (TMR) has carved a new research report on the global CMP slurry market, which delivers insights for the forecast period (2017-2026). The report estimates critical factors such as entry of new vendors to impel growth prospects of the market in the near future. Majority of new vendors are established players in production of core electronic device components. These vendors are likely to develop & introduce advanced materials and chemicals equipped with latest technologies.

The global market for chemical mechanical polishing/planarization (CMP) slurry is fragmented owing to occupancy of several vendors. Major players in the market are continuously taking efforts to increasing their presence globally by employing key strategies such as joint ventures, mergers & acquisitions, and new product development. Key market players identified by the report include Fujimi Corporation, Evonik, 3M, Applied Materials, BASF, Dow Chemicals, FujiFilm, Samsung Electronics, Hitachi Chemical, and Cabot Corporation.

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CMP Slurry to Witness Growing Demand in Front-end Semiconductor Applications

The global market for CMP slurry has been projected to register a spectacular CAGR through 2026. Worldwide sales of CMP slurry is estimated to account for nearly US$ 3,500 Mn revenues by 2026-end. With the rise of the semiconductor materials and equipment industry, engineers are continuously working on the optimization of CMP processes for enabling an ever-surging slurry dilution, and evaluating new pad entrants in the market. Unlike front-end semiconductor applications, the back-end processing has long utilized CMP slurries. However, with the transistor level becoming critical, CMP slurry is now observed as the enabling technology for front-end processing as well. It is being deployed in an array of front-end applications, particularly in memory devices, and for implementing metal gate integration schemes.

The front-end semiconductor applications involve several different stages wherein various materials are needed to be polished, thereby entailing requirement for different type of slurries. The advent of new device structures is creating demand for new single-layer slurries with fixed product development cost, making it challenging for suppliers to attain return on investment (ROI), which they acquire with copper and tungsten slurries.

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