Radio Frequency Transmitter Encapsulant Is Estimated To Witness High Growth Owing To Increasing Demand From Consumer Electronics Industry
The Radio Frequency Transmitter Encapsulant market is estimated to be valued at US$ 2.53 Bn in 2023 and is expected to exhibit a CAGR of 5.5% over the forecast period 2023 to 2030, as highlighted in a new report published by Coherent Market Insights.
Market Overview:
The radio frequency transmitter encapsulant market encompasses encapsulants that are used to protect sensitive electronic components such as power amplifiers, oscillators, and filters from physical and electrical interference in devices that transmit radio frequencies such as Wi-Fi, Bluetooth, cellular networks, satellites, and other applications. Encapsulants prevent electromagnetic interference by acting as an insulator allowing passage of signals while blocking stray currents. They also provide mechanical protection and thermal management. Common uses include in smartphones, wireless routers, mobile hotspots, and aerial transmit modules.
Market Dynamics:
The radio frequency transmitter encapsulant market is driven by increasing demand from consumer electronics industry. Rapid proliferation of smartphones, tablets and other networked mobile devices that utilize various wireless technologies like 4G, 5G, Wi-Fi and Bluetooth is a key driver as they require radio frequency transmitters to be encapsulated reliably. Another driver is expansion of wireless infrastructure including macro and small cell base stations for mobile networks requiring power amplifiers and antennas modules to be protected. Rising adoption of IoT connected devices across various industries is also facilitating growth of market. However, availability of alternative insulating and protective materials can restrain market growth.
SWOT Analysis
Strength: Radio Frequency Transmitter encapsulant materials provide protection and seal to electronic components from environmental factors like moisture, dust, vibration and thermal stress. They offer durability, reliability and longevity. Encapsulant materials also provide electrical insulation and thermal management.
Weakness: Development of new encapsulant materials requires extensive research and testing to ensure long-term reliability under harsh operating conditions of radio frequency devices. Certain encapsulant chemistries pose challenges in recyclability.
Opportunity: Growth of 5G mobile networks and increasing deployment of small cell sites and telecom towers will drive the demand for radio frequency components requiring protection. Emerging applications in automotive electronics, IoT devices and wearables also open new opportunities.
Threats: Stringent regulatory standards pertaining to material composition and recyclability pose compliance challenges. Price fluctuations of raw material inputs also impact the encapsulant material costs.
Key Takeaways
The global Radio Frequency Transmitter Encapsulant Market Size is expected to witness high growth, exhibiting CAGR of 5.5% over the forecast period, due to increasing deployment of 5G infrastructure and emerging applications in automotive electronics and IoT devices.
Regional analysis: Asia Pacific dominated the global market in 2023, accounting for over 35% of the total share, driven by strong presence of RF component manufacturers and electronic assembly industries in China, South Korea, Taiwan and India. North America is expected to grow at the fastest rate during the forecast period owing to rising adoption of 5G technologies in the US and Canada.
Key players analysis: Key players operating in the Radio Frequency Transmitter encapsulant market are Dow, Henkel, BASF, Nordson, LORD Corporation, H.B. Fuller, Siltech Corporation, Qualcomm, Broadcom, Skyworks Solutions, Qorvo. Dow and Henkel capture over 30% of the global market share between them.