This report studies the System-in-Package market size by players, regions, product types and end industries, history data 2013-2017 and forecast data 2018-2025; This report also studies the global market competition landscape, market drivers and trends, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.

SiP is a packaging technology, which contains multiple die in a single module. It is a mixture of various integrated circuits in a compact size, which further reduces the cost to develop and assemble a printed circuit board (PCB). SiP dies can be stacked vertically or tiled horizontally with standard off-chip wire bonds or solder bumps.

The emergence of advanced and compact consumer electronic devices as one of the primary growth factors for this semiconductor packaging market. The consumer electronics devices industry has witnessed a massive transformation in the recent years, where feature phones were replaced by smartphones and personal computers by laptops and tablets. Furthermore, the adoption of the smart homes concept, where electronic devices can be monitored and controlled with the help of mobile applications, will further transition this industry. This will induce electronic device manufacturers to constantly upgrade their products in terms of several factors such as design, processing power, power consumption, and user-interface, that will require the use of robust technology and develop compact devices. This demand for compact electronic devices will compel semiconductor manufacturers to develop denser ICs with increased circuitry, which will boost the demand for advanced IC packagingtechniques such as SiP.

In 2017, the global System-in-Package market size was 5220 million US$ and it is expected to reach 10900 million US$ by the end of 2025, with a CAGR of 9.6% between 2018 and 2025.

This report focuses on the global top players, covered

Amkor Technology

ASE

Jiangsu Changjiang Electronics Technology (JCET)

Siliconware Precision Industries (SPIL)

United Test and Assembly Center (UTAC)

...

Market segment by Regions/Countries, this report covers

North America

Europe

China

Rest of Asia Pacific

Central & South America

Middle East & Africa

Market segment by Type, the product can be split into

2D IC

2.5D IC

3D IC

Market segment by Application, the market can be split into

Consumer Electronics

Communications

Automotive & Transportation

Aerospace & Defense

Healthcare

Others

The study objectives of this report are:

To study and forecast the market size of System-in-Package in global market.

To analyze the global key players, SWOT analysis, value and global market share for top players.

To define, describe and forecast the market by type, end use and region.

To analyze and compare the market status and forecast among global major regions.

To analyze the global key regions market potential and advantage, opportunity and challenge, restraints and risks.

To identify significant trends and factors driving or inhibiting the market growth.

To analyze the opportunities in the market for stakeholders by identifying the high growth segments.

To strategically analyze each submarket with respect to individual growth trend and their contribution to the market

To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.

To strategically profile the key players and comprehensively analyze their growth strategies.

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